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Analogic Corporation is a designer and manufacturer of advanced
systems and subsystems. These systems often consist of a complicated
chassis with multiple sub-compartments each with electronics that
require heat dissipation.
This type of complicated flow chassis can be observed in one of
our current projects. Using Coolit to model the general chassis
setup with simplified geometry, initial flow patterns could be observed
quickly and easily. Once the overall flow pattern was established
and optimized, Coolit was then used to specifically model individual
sub-compartments.
Currently pictured are a board and the main heat producing chips
in a sub-compartment. The compartment was modeled with the intent
of evenly distributing the flow over the chips and to promote uniform
heat dissipation. The original proposal was a simple configuration
of one inlet fan on the side of compartment and a top exit vent.
This configuration, modeled in Coolit and confirmed in experimental
testing, resulted in a sweeping flow path that left dead areas of
flow and high temperatures at the top-right and lower-left chips.
After this data was evaluated, it was thought that a second fan
would be needed to cool the compartment. This second configuration
was then run in Coolit and it resulted in the same sweeping flow
path with increased dead flow areas. By using Coolit and running
a variety of baffle, fan, and vent combinations, an optimal solution
was found. It was discovered, that simple baffle attachments to
the board could direct the flow from a single fan so that the chips
are properly cooled.
Using Coolit, significantly reduced time to market as well as
improved quality and reliability of the new product.
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